Brief: Discover the Violet Customizable Thermal Pad, a high-performance silicon thermal pad designed for efficient heat dissipation in electronic components. The TIF500 Series offers excellent thermal conductivity, flexibility, and customization options for various applications.
Related Product Features:
효율적인 열 전달을 위해 2.6 W/mK의 좋은 열 전도성
Available in various thicknesses from 0.25mm to 5.0mm to suit different needs.
Broad range of hardness options for versatile applications.
Moldable for complex parts, ensuring a perfect fit.
뛰어난 열 성능은 부품 수명을 연장합니다.
고온 환경에서의 안전을 위해 난연 등급 94 V0.
Customizable with pressure-sensitive adhesive on one or both sides.
Reinforcement options include fiberglass for added durability.
자주 묻는 질문:
TIF500 시리즈 열 패드의 열 전도성은 무엇입니까?
TIF500 시리즈 써멀 패드는 열전도율이 2.6 W/mK로, 효율적인 열 전달을 보장합니다.
Can the thermal pad be customized with adhesive?
Yes, the thermal pad can be customized with pressure-sensitive adhesive on one side (A1 suffix) or both sides (A2 suffix).
What are the typical applications for this thermal pad?
Typical applications include RDRAM memory modules, automotive engine control units, telecommunication hardware, and handheld portable electronics.
TIF500 시리즈에 유리섬유 강화가 있습니까?
네, 내구성을 향상시키기 위해 TIF500 시리즈 시트에 유리 섬유 보강재를 추가할 수 있습니다.