Brief: Discover the Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules, ideal for high-performance thermal management in electronics. With excellent thermal conductivity and durability, these modules are perfect for microprocessors, memory modules, and more.
Related Product Features:
효율적인 열 분비를 위해 0.014°C-in2/W의 낮은 열 저항.
Naturally tacky at room temperature, eliminating the need for adhesives.
No heat sink preheating required, simplifying installation.
Durable performance with no degradation after 1,000 hours at 130℃.
Available in multiple thicknesses: 0.005”, 0.008”, 0.010”, and 0.012”.
Thermal conductivity of 5.0 W/mK for superior heat transfer.
Suitable for a wide temperature range from -25℃ to 125℃.
독립형이며 유연하며, 보강 부품이 필요하지 않습니다.
자주 묻는 질문:
What is the phase change softening temperature of the TIC™800G Series?
The TIC™800G Series begins to soften and flow at 50℃ to 60℃, filling microscopic irregularities for reduced thermal resistance.
Can the TIC™800G Series be used without adhesive?
Yes, the material is naturally tacky at room temperature, so no adhesive is required for installation.
What applications are suitable for the TIC™800G Series?
It is ideal for high-frequency microprocessors, notebooks, desktop PCs, memory modules, cache chips, and IGBTs.