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High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications

  • High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications
  • High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications
High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications
제품 상세 정보:
원래 장소: 중국
브랜드 이름: Ziitek
인증: UL
모델 번호: TIF050-11-1
결제 및 배송 조건:
최소 주문 수량: 1000튜브
가격: 0.1-100USD/KG
포장 세부 사항: 300cc/pcs, 6pcs/box
배달 시간: 3-8 일
지불 조건: t/t
공급 능력: 10000KG/Month
접촉
상세 제품 설명
제품 이름: PCB 응용 분야에 적합한 높은 전도성 열 젤 5.0W/MK 절연 열 전도성 젤 비중: 3.25g/cc
색상: 어두운 회색 Materail: 세라믹이 채워진 실리콘 소재
항복전압(V/mm): ≥6000 열전도율: 5.0W/m-k
예어: 열 젤 적용: PCB 애플리케이션
다이렉트릭 상수 @ 1MHz: 7.7

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications

 

TIF®050-11-1 is a thermally conductive paste with excellent interface thermal resistance characteristics and outstanding plasticity, capable of fully meeting the strict thermal management performance requirements of various designs; this material has extremely low hardness, possesses free-forming ability, and is easy to construct and assemble, demonstrating good stability in high-temperature environments. Its low-stress characteristics are particularly suitable for electronic devices that require high precision and high reliability, effectively reducing the mechanical stress on sensitive components during assembly and operation, ensuring the long-term stable operation of products in various application  environments.

 

Feature

 

> Thermal conductivity: 5.0 W/mK
> Low stress, protect sensitive components.
> Strong plasticity. good stability
> Superior dielectric properties

 

Application

 

> Power module
> LED backlight module, LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment

 

TIF®050-11-1 Typical Properties
Property Value Test method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicon material ******
Density(g/cm³) 3.25g/c ASTM D792
Thermal conductivity 5.0W/mK ASTM D5470
Breakdown Voltage (V/mm) ≥6000 ASTM D149
Dielectric constant @1MHz 7.7 ADTM D150
Flame Rating V-0 UL 94
Volume resistivity(Ohm.cm) 8.0 X 1013 ASTM D257

 

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications 0

Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

연락처 세부 사항
Dongguan Ziitek Electronical Material and Technology Ltd.

담당자: Dana Dai

전화 번호: +86 18153789196

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