 
|
| 원래 장소: | 중국 |
| 브랜드 이름: | Ziitek |
| 인증: | UL & RoHS |
| 모델 번호: | TIF500-30-11US |
| 최소 주문 수량: | 1000PCS |
|---|---|
| 가격: | 0.1-10 USD/PCS |
| 포장 세부 사항: | 24*13*12cm 상자 |
| 배달 시간: | 3-5 영업일 |
| 지불 조건: | 티/티 |
| 공급 능력: | 10000000 PCS/월 |
| 제품명: | CPU GPU AI 및 프로세서를 위한 뛰어난 전도성 및 절연성을 갖춘 고성능 3.0W/MK 실리콘 열 패드 | 두께 범위: | 0.25~5.0mm /(0.010~0.20인치) |
|---|---|---|---|
| 경도: | 20 버팀목 00 | 밀도: | 3.1g/cm³ |
| 열전도율: | 3.0W/m-K | 색상: | 어두운 회색 |
| 키워드: | 실리콘 써멀 패드 | 애플리케이션: | CPU GPU AI 및 프로세서 |
High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors
Products Description
TIF®500-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Features:
> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> RoHS compliant
> UL recognized
Applications:
> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> Display card
> Mainboard/mother board
> Notebook
| Typical Properties of TIF®500-30-11US Series | |||
| Property | Value | Test method | |
| Color | Dark gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.5) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 6.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 3.0 W/m-K | ASTM D5470 | |
| 3.0 W/m-K | ISO22007 | ||
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q:Is there promotion price for big buyer?
A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
담당자: Dana Dai
전화 번호: +86 18153789196
