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Good Insulation Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Good Insulation Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

제품 상세 정보:
원래 장소: 중국
브랜드 이름: Ziitek
인증: UL & RoHS
모델 번호: TIF100-50-11U
결제 및 배송 조건:
최소 주문 수량: 1000개
가격: 0.1-10 USD/PCS
포장 세부 사항: 24*13*12cm 상자
배달 시간: 3-5 영업일
지불 조건: 티/티
공급 능력: 10000000 PCS/월
접촉
상세 제품 설명
제품명: AI 프로세서 AI 서버를 위한 우수한 절연 실리콘 기반의 매우 부드러운 열 GAP 패드 재료 열전도율: 5.0W/m-k
건설: 세라믹 충전 실리콘 엘라스토머 두께: 0.25-5.0mmT
유전체 파괴 전압: > 5500 VAC 비중: 3.4 g/cm³
키워드: 열 GAP 패드 재료 애플리케이션: 5G 항공우주, AI 프로세서, AI 서버

Good Insulation Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

 

Products description

 

TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Features


>High thermal conductivity
>Super soft and highly compliant
>Self-adhesive without the need for additional surface adhesives
>Good insulation performance

 

Application:


Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

 

Typical Properties of The TIF®100-50-11U Series
Property Value Test method
Color Dark gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Good Insulation Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers 0

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

연락처 세부 사항
Dongguan Ziitek Electronical Material and Technology Ltd.

담당자: Dana Dai

전화 번호: +86 18153789196

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