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제품 소개실리콘 열 패드

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields

제품 상세 정보:
원래 장소: 중국
브랜드 이름: Ziitek
인증: UL and RoHs
모델 번호: TIF100-20-10S
문서: TIF100-20-10S_Data Sheet.pdf
결제 및 배송 조건:
최소 주문 수량: 1000 PC
가격: 0.1-10 USD/PCS
포장 세부 사항: 24*13*12cm 판지
배달 시간: 3-8 근무일
지불 조건: 티/티
공급 능력: 100000pcs/월
접촉
상세 제품 설명
제품명: 전자 및 산업 분야의 열 방출을 위해 설계된 실리콘 열 패드 열 전도성 갭 필러 패드 건설: 세라믹 충전 실리콘 엘라스토머
경도: 65/45 쇼어 00 색상: 회색
애플리케이션: 전자 및 산업 분야 전도성 있는 열식: 2.0 마크로
두께: 0.010 "(0.25mm) ~ 0.200"(5.0mm) 밀도: 2.65g/cm3
키워드: 실리콘 열 패드 견본: 무료 샘플

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields


Company Profile 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields 0


Products description

TIF®100-20-10S Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.


Features

>Good thermal conductive 
>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating
>Available in varies thicknesses

Applications

>Embedded Motherboard
>Industrial visual inspection equipment
>Graphics card cooling module
>Charging pile power module
>Central control screen
>Home appliance industry
>Power module
>Wearable device
>Solar photovoltaic panel
>LED lighting fixtures

 

Key attributes


Typical Properties of TIF®100-20-10S Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 4.7 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.7 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity(W/m-K) 2.0 ASTM D5470
2.0 ISO22007

 

Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16” (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields 1


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Silicone Thermal Pad Thermal Conductive Gap Filler Pads Designed For Heat Dissipation In Electronic And Industrial Fields 2


Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

FAQ

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Q: How do I place an order? 

A:1. Click the "Sent messages" button to continue with the process. 

2. Fill out the message form by entering a subject line, and message to us.  

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us 

4. We will reply you as soon as possible with Email or online 

 

Q: How do I request customized samples? 

A: To request samples, you can leave us message on website, or just contact us by send email or call us. 

연락처 세부 사항
Dongguan Ziitek Electronical Material and Technology Ltd.

담당자: Dana Dai

전화 번호: +86 18153789196

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