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Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates

Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates

제품 상세 정보:
원래 장소: 중국
브랜드 이름: Ziitek
인증: UL & RoHS
모델 번호: TIF100-15-11F 시리즈
문서: TIF100-15-11F_Data Sheet.pdf
결제 및 배송 조건:
최소 주문 수량: 1000개
가격: 0.1-10 USD/PCS
포장 세부 사항: 24*13*12cm 판지
배달 시간: 3-5 영업일
지불 조건: 티/티
공급 능력: 10000000 PCS/월
접촉
상세 제품 설명
제품명: 공극을 채우고 전자 부품과 냉각판 사이의 열 전달을 향상시키도록 설계된 열 갭 필러 생각 범위: 0.010 "(0.25mm) ~ 0.200"(5.0mm)
인증: RoHS and UL recognized 견본: 샘플 사용 가능
플램 등급: 94 V0 경도: 65/60 해안 00
열전도율: 1.5W/MK 색상: 다크 그레이
키워드: 열 갭 필러

Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
TIF®100-15-11F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is ideal for applications requiring a balance between heat dissipation, insulation, and mechanical stability.
Key Features
  • Excellent thermal conductivity: 1.5 W/mK
  • Soft and compressible for low stress applications
  • Naturally tacky needing no further adhesive coating
  • Available in various thicknesses
  • Broad range of hardnesses available
Applications
Cooling components to chassis or frame
High speed mass storage drives
LED TV and LED-lit lamps
RDRAM memory modules
Micro heat pipe thermal solutions
Display cards and motherboards
Notebook computers and power supplies
Telecommunication hardware
Memory modules
Home appliance industry
Power module
Wearable devices
Technical Specifications of TIF®100-15-11F Series
Property Value Test Method
Color Dark Gray Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 2.2 ASTM D792
Thickness Range 0.010"~0.020" | 0.030"~0.200"
0.25~0.50mm | 0.75~5.00mm
ASTM D374
Hardness (Shore 00) 65 | 60 ASTM 2240
Operating Temperature -40 to 200℃ -
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity >1.0*10¹² Ohm-meter ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 1.5 W/m-K ASTM D5470 / ISO22007
Product Dimensions
Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm) with 0.010" (0.25 mm) increments
Standard Size: 16" * 16" (406 mm * 406 mm)
Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

TIF®100-15-11F Series Thermal Gap Filler product image
Packaging & Lead Time
Packaging: Protected with PET film or foam, paper card separation between layers, export carton packaging, customizable to customer requirements.
Lead Time: For quantities of 5000 pieces, delivery time is negotiable.
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a manufacturer based in China.
Do you accept custom orders?
Yes, we welcome custom orders. We can customize dimensions, shapes, colors, and apply adhesive coatings or fiberglass reinforcement as required. Please provide drawings or detailed specifications.
How much do the pads cost?
Pricing depends on size, thickness, quantity, and specific requirements such as adhesive applications. Please provide these details for an exact quote.
Our Services
  • 12-hour online service with fast inquiry response
  • Business hours: 8:00 AM - 5:30 PM, Monday to Saturday (UTC+8)
  • Experienced English-speaking support staff
  • Standard export packaging or customized marking
  • Free samples available
  • Comprehensive after-sales support and problem resolution

연락처 세부 사항
Dongguan Ziitek Electronical Material and Technology Ltd.

담당자: Dana Dai

전화 번호: +86 18153789196

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