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Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink

Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink

제품 상세 정보:
원래 장소: 중국
브랜드 이름: Ziitek
인증: UL
모델 번호: TIF100L 3030-06
문서: TIF100L 3030-06_Data Sheet ...t .pdf
결제 및 배송 조건:
최소 주문 수량: 1000 PC
가격: 0.1-10 USD/PCS
포장 세부 사항: 24*13*12cm 판지
배달 시간: 3-8 근무일
지불 조건: 티/티
공급 능력: 100000pcs/월
접촉
상세 제품 설명
제품명: 전자 부품과 방열판 사이의 열 전달을 최적화하기 위해 저휘발성 실리콘과 세라믹 필러를 사용한 열 갭 필러 건설: 세라믹 충전 실리콘 엘라스토머
경도: 65/30 쇼어 00 색상: 하얀색
애플리케이션: 전자 부품과 방열판 사이의 열 전달을 최적화하려면 전도성 있는 열식: 3.0 마크로
두께: 0.010 "(0.25mm) ~ 0.200"(5.0mm) 밀도: 30.0g/cm3
키워드: 열 갭 필러

Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink


Company Profile


Dongguan Ziitek Electronic Material and Technology Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Products description

The TIF®100L 3030-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits. And the material has excellent flexibility and elasticity, which can fully fill the micro gaps between the heating interface and the heat dissipation structure, significantly reduce the contact thermal resistance,improve the thermal conductivity efficiency, and ensure the reliability and service life of electronic components in long-term operation.


Features

> Ultra low volatility of siloxane
> Good thermal conductivity
> Excellent weather resistance and aging resistance
> Highly compressible, easy to install and operate
> Good insulation performance

Applications

> Motor Controller (MCU)
> Airborne computer
> Machine vision camera
> High performance ASIC chip
> Central control screen


Typical Properties of TIF®100L 3030-06 Series
Property Value Test method
Color White Visual
Construction Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
0.25~0.50 0.75~5.00
Hardness ( Shore 00) 65 30 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity(W/m-K) 3.0 ASTM D5470
3.0 ISO22007


Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm),with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmx406 mm)


The TIF® series is available in custom shapes andvarious forms.
For other thicknesses or more information, please contact us.

Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink

Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete  teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


FAQ


Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.


Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.


Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

연락처 세부 사항
Dongguan Ziitek Electronical Material and Technology Ltd.

담당자: Dana Dai

전화 번호: +86 18153789196

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